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Silver migration and galvanic corrosion prevention for bonding aluminum and copper electrodes.
Conductive adhesive that does not use conventional silver fillers For high-temperature and high-humidity applications concerned about silver migration For conductive adhesion to aluminum where galvanic corrosion is a concern For electrode adhesion of FPC (Flexible Printed Circuit)
Pro-quality conductive repair, completed with one hand.
■ Easy electrical bonding without soldering Enables secure electrical connections without the need for soldering, making it suitable for users who are not skilled with soldering tools or for environments where heat cannot be applied. ■ Safe for heat-sensitive components and flexible substrates Cures at room temperature, preventing thermal damage to LEDs, plastic parts, FPCs, and other heat-sensitive devices. ■ Strong adhesion with stable, low-resistance conductivity Optimized silver filler formulation provides both excellent conductivity and high adhesive strength, ensuring long-term reliability even under vibration or mechanical stress. ■ Flexible after curing—ideal for bent or vibrating areas Maintains flexibility after curing, enabling use on curved surfaces, moving parts, or areas subject to repeated bending. ■ Suitable for creating or repairing circuit patterns Can be applied to form or repair conductive traces, making it useful for prototyping, R&D, and precision repair work. ■ Automatic mixing with a dedicated nozzle—simple one-handed operation A single push dispenses and mixes both components automatically, eliminating manual ratio control and improving work efficiency. ■ No special storage requirements Can be stored at room temperature—no refrigeration or freezing required—making it convenient for on-site use.
